Citation
Yoonmyung Lee, Ye-Sheng Kuo, Pat Pannuto, Ron Dreslinski, Prabal Dutta, David Blaauw. "Architectural Challenges for MM-scale Sensor Nodes". Talk or presentation, 23, September, 2013; Presented at the First International Workshop on the Swarm at the Edge of the Cloud (SEC'13 @ ESWeek), Montreal.

Abstract
Recent improvement of IC design and packaging technology has enabled integration of microsystem on the mm-scale. Recent low power circuit research has reduced power consumption of key microsystem elements, such as CPU, memory, sensor front ends and radios, to the nW level which enables mm-scale sensor nodes of reasonable lifetime with mm-sized micro-batteries and harvesters. However, the extreme limit on volume, energy, and lifetime creates unique implementation and architectural constraints. Furthermore, the extremely wide application space of this new computing class make a flexible and re-targetable design strategy essential. To address these unique challenges, we discuss a new ultra-low power sensor node architecture that is layer-based and modular. The proposed architecture allows efficient sensor node implementation for various applications with reuse of commonly used components and diverse technology selection for application-specific components on separate layers. Inter-layer interconnect through an ultra-low power bus architecture are addressed, as well as micro-architectural challenges incurred by the layered structure. We demonstrate the proposed concepts with two diverse 1-mm3 sensor node example systems that illustrate the benefits of our modular approach. The first is an imager and temperature sensor and the second in an implantable medical sensor for tumor monitoring that was implanted in an animal.

Electronic downloads

• ArchitecturalChallengesforMMScaleSensorNodes_Lee_SEC13_Montreal.pdf · application/pdf · 3813 kbytes
• http://www.src.org/library/publication/p068002/. (SRC website)
• lee_archchallenges_edge.pdf · application/pdf · 15 kbytes. (Abstract)

• HTML

  Yoonmyung Lee, Ye-Sheng Kuo, Pat Pannuto, Ron Dreslinski,
  Prabal Dutta, David Blaauw. <a
  href="http://www.terraswarm.org/pubs/120.html"><i>Architectural
  Challenges for MM-scale Sensor Nodes</i></a>,
  Talk or presentation,  23, September, 2013; Presented at the
  <a
  href="http://www.terraswarm.org/conferences/13/swarm/index.htm"
  >First International Workshop on the Swarm at the Edge of
  the Cloud (SEC'13 @ ESWeek)</a>, Montreal.

• Plain text

  Yoonmyung Lee, Ye-Sheng Kuo, Pat Pannuto, Ron Dreslinski,
  Prabal Dutta, David Blaauw. "Architectural Challenges
  for MM-scale Sensor Nodes". Talk or presentation,  23,
  September, 2013; Presented at the <a
  href="http://www.terraswarm.org/conferences/13/swarm/index.htm"
  >First International Workshop on the Swarm at the Edge of
  the Cloud (SEC'13 @ ESWeek)</a>, Montreal.

• BibTeX

  @presentation{LeeKuoPannutoDreslinskiDuttaBlaauw13_ArchitecturalChallengesForMMscaleSensorNodes,
      author = {Yoonmyung Lee and Ye-Sheng Kuo and Pat Pannuto and
                Ron Dreslinski and Prabal Dutta and David Blaauw},
      title = {Architectural Challenges for MM-scale Sensor Nodes},
      day = {23},
      month = {September},
      year = {2013},
      note = {Presented at the <a
                href="http://www.terraswarm.org/conferences/13/swarm/index.htm"
                >First International Workshop on the Swarm at the
                Edge of the Cloud (SEC'13 @ ESWeek)</a>, Montreal.},
      abstract = {Recent improvement of IC design and packaging
                technology has enabled integration of microsystem
                on the mm-scale. Recent low power circuit research
                has reduced power consumption of key microsystem
                elements, such as CPU, memory, sensor front ends
                and radios, to the nW level which enables mm-scale
                sensor nodes of reasonable lifetime with mm-sized
                micro-batteries and harvesters. However, the
                extreme limit on volume, energy, and lifetime
                creates unique implementation and architectural
                constraints. Furthermore, the extremely wide
                application space of this new computing class make
                a flexible and re-targetable design strategy
                essential. To address these unique challenges, we
                discuss a new ultra-low power sensor node
                architecture that is layer-based and modular. The
                proposed architecture allows efficient sensor node
                implementation for various applications with reuse
                of commonly used components and diverse technology
                selection for application-specific components on
                separate layers. Inter-layer interconnect through
                an ultra-low power bus architecture are addressed,
                as well as micro-architectural challenges incurred
                by the layered structure. We demonstrate the
                proposed concepts with two diverse 1-mm3 sensor
                node example systems that illustrate the benefits
                of our modular approach. The first is an imager
                and temperature sensor and the second in an
                implantable medical sensor for tumor monitoring
                that was implanted in an animal.},
      URL = {http://terraswarm.org/pubs/120.html}
  }
  

Posted by Christopher Brooks on 29 Sep 2013.